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via-fill-vs-via-in-padBlind Vias start on an outer layer but terminate on an inner layer. Buried Vias exist only between inner layers. Blind and buried vias save real estate as features and lines are designed above or below them without connection. Fine pitch BGA and flip-chip component footprints restrict traces.

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HDI will be critical in reducing the size of LiDAR PCBs for autonomous vehicles. Mobile and wireless technology for Telecommunications and Computing drives the need for smaller vias with increased functionality.

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HDI via fill plating boosts production time and increases density and functionality by providing finer lines and spaces. Combined with laser drilling, sequential lamination technology, and direct imaging, this plating process allows for the creation of any-layer via technology.

HDI sample circuit board: Cu Via Fill

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  • Desemar and deash
  • Hole preparation
  • Copper plating and copper filled via
Laser Drilled Blind and Buried Vias: Click here for more

Sample Boards
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PTFE  Cavity
Mouse over pictures below to see description

                 


Blind and Buried Via Sample Boards



SFS Blind and Buried Vias Sample Boards: Click here
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